02.02.2026
New Success Story: AM2pC
The AM2pC project successfully demonstrated a new class of additively manufactured (AM) two-phase cooling systems capable of handling extreme heat loads relevant for next-generation AI and high-performance computing (HPC) infrastructure.
As the power consumption and waste heat generation of modern IT hardware continues to grow, conventional thermal management concepts, such as air cooling, must be replaced with more effective and more efficient concepts. This challenge motivated the development of a passive two-phase cooling system, which extracts heat through evaporation and condensation of a refrigerant. While these systems offer much more efficient heat removal compared to established solutions, their implementation in electronics cooling remains in very early stages.By combining Laser Powder Bed Fusion (PBF-LB) with advanced multiphysics simulation and topology optimisation, the consortium developed novel vapour chamber concepts with integrated capillary structures manufactured as monolithic metal components.
Read more about the success stories of projects funded within the M-ERA.NET Calls: here