Printed Resistive Integrated Multimaterials for Electronics - PRIME_

Project summary

PRIME addresses critical challenges in developing high-performance functional materials for semiconductor and electronic manufacturing. The project establishes an integrated framework combining biomass-derived feedstocks, multi-material additive manufacturing, and ultrafast thermal consolidation (sintering) to enable single-step fabrication of electroceramic components with co-integrated conductive and insulating regions. This approach overcomes current limitations of multi-step joining and coating processes, enhancing material compatibility and structural integrity. The technology will be validated through prototype demonstrators such as wafer chucks and process heaters with embedded thermal management. PRIME advances the additive manufacturing of electroceramics from laboratory feasibility to prototype validation, aiming to reduce energy consumption and material waste while increasing functional integration, reliability, and sustainability in advanced manufacturing environments.