Topic 6
Next Generation Materials for Electronics

Disruptive evolution of electronics always came together with the development and integration of advanced materials, illustrating the transformative potential of materials in our daily life. The European Union is aware of the need of creating a diverse and dynamic microelectronics ecosystem and, at the same time, is concerned about the sustainability challenges related to deploying electronics applications like high-rate tele-/data-communications (5G, 6G connectivity), Internet of Things (IoT), Industry 4.0, AI or Advanced Computing, that will require a huge production of electronic components, absorb an increasing amount of energy, and rely on imported critical raw materials. This challenge also opens a window of opportunity to research and design the next generation of materials for sustainable electronics, delivering improved performance and energy efficiency. At the same time, these materials and processing routes can reduce electronic waste and enhance the recyclability of the electronic components, moving towards greener production processes. This aligns with the Green Deal that seeks to accelerate technological progress by reducing the carbon footprint and promoting a circular economy.

The topic supports proposals on materials research and its application, with special focus on specific properties for electronics, including sensors and SSbD materials modelling.

• Proposals should address at least one of the following items:

  • Materials complementary to silicon electronics (low-dimensional materials, 2D materials, hybrid heterostructures, topological materials, etc.)
  • Materials for sensors and sensor arrays, and their actuators, transducers, processors
  • Materials for thermal management in electronics
  • Wearable, flexible, stretchable, organic and/or conformable materials for responsible electronics
  • Implantable, ingestible and bioresorbable materials for sensing.
  • Materials for ultralow-power memories and electronics
  • Materials for high-power electronics (GaN, GaxOy, SiC, C, etc.)
  • Materials for More-than-Moore electronics (spintronics, orbitronics, valleytronics, etc.)
  • Materials for optoelectronics, photonics and integrated photonics (for tele/data-com, quantum communications, sensing, etc.)
  • Substitution of hazardous or critical raw materials, reduced carbon footprint and green electronics
   

Inclusion of one or more of the following cross-cutting aspects would be considered a strength:

• High throughput manufacturing approaches for electronic components (printing technologies, additive manufacturing techniques, laser-induced processes, etc.).
• The consideration of SSbD materials.
• Where relevant, the integration of computational modelling, artificial intelligence (AI), machine learning (ML), and advanced data management tools to accelerate materials design, modelling, characterization, development and system optimisation.

Proposals shall address how they will contribute to the expected impact of the topic, addressing at least two of the following aspects:

• New electronic materials enabling sustainable economic growth and technological sovereignty.
• Development of new technologies for electronics to solve societal challenges and improve quality of life in a wide range of applications (e.g., human-machine interface, health management, environment monitoring, precision agriculture, energy and mobility, tele-/dat-communications, etc.). 
• Reduction of the carbon footprint and critical raw material content of the materials used in the developed technologies.

The proposal impacts should be substantiated with key performance indicators. All proposals should clearly state the TRL at the project start and at the project end. The proposals based on original and innovative approaches may start with TRL 1. The proposals should include a plan for the transition to higher TRLs at a later stage (i.e., beyond the project end date). Establishing an industrial and societal stakeholder advisory board or the participation of one or more companies in the project consortium is encouraged.

M-ERA.NET requires that all proposers explain how their projects demonstrate a commitment to RRI by investigating and addressing the environmental, social, ethical, political, or cultural dimensions of the proposed research:

In line with the M-ERA.NET RRI annex, proposals should consider the following points:

• Sustainability aspects along materials, processing, and products covering the environmental, economic and social dimension. 
• Resources: the use of resources overall, the environmental properties of the materials, the use of critical raw materials, energy, water, etc. 
• Green-production-processes: use of environmentally friendly solvents, avoiding hazardous elements, substances of concern, minimizing energy and water consumption during production and preserving worker’s health
• Use phase: the sustainability of the conditions under which the material can be used (continuous energy use, releases to the environment, life span, etc.). 
• (When relevant) end of life: the entry of the material into the circular economy, including re-use, re-manufacturing or recycling considerations. 
• Inclusion of relevant societal stakeholders as appropriate.
• Potential trade-offs between sustainability burdens and benefits.

Proposals should describe potential trade-offs between sustainability burdens and benefits, and include an activity where relevant aspects are further investigated, potentially with corresponding impacts on the design of the material(s).

This topic is targeted at academic research groups, SMEs, or large enterprises. In proposals targeting TRL 4 and higher, industrial partners and at least one project partner specialised on customer or end-user demands should be involved in the project consortium. Collaboration between research entities and industrial partners is encouraged also at lower TRLs.

Projects submitted to this Topic should choose at least 2 keywords from the following list:

5G/6G connectivity, Bioelectronics; Flexible electronics; Integration; High-power-control electronics; Memories; Neuromorphic electronics;Organic electronics; Optoelectronics; Packaging and housing; Photonics; Printed electronics; Sensors; Spintronics; Sustainable processing; Thermal management; Ultralow-power electronics

General keywords (KWs) (such asAdditive manufacturing / 3D printing; Durability; Nanomaterials; Recyclability…) and Additional KWs (free text) can also be chosen in the submission platform. The ensemble of the keywords should allow for an overview of the scope of the project (consider describing different aspects of the project such as main scientific area / domain, system / property / material of interest, applications / objectives and pertinent procedures / techniques).