Photo-Atomic Layer Printing - PhotoPrint
Project summary
Chip manufacturing is resource-intensive relying on critical raw materials (CRMs). Methods are rigid to change and sensitive to issues in supply chains. Essential thin-film patterning by photolithography makes lots of toxic waste. Needed better chip performance adds environmental risks in manufacturing._x000D_ Objectives: Proof of concept, photolithography-free-thin-film deposition equipment for chip manufacturing with Photo-assisted Atomic Layer Deposition. New process chemistries enabling direct pattern printing. Validated technology via novel neuromorphic chips in sensors and memristors. Communicate, disseminate, and scale up the developed solutions. PhotoPrint will enable novel chip designs, like neuromorphics, and circuitry on various products. Beyond the project, PhotoPrint will revolutionize chip manufacturing with reduced environmental footprint. PhotoPrint will be accessible to a broad audience, facilitating inclusiveness and microelectronics for a sustainable and responsible societyProject Details
Call
Call 2024
Call Topic
Functional materials
Project start
01.05.2025
Project end
01.05.2028
Total project costs
1.075.670 €
Total project funding
719.754 €
TRL
2 - 4
Coordinator
Prof. Dr. Ville Miikkulainen
ville.miikkulainen@aalto.fi
Aalto University, Kemistintie 1, 02150 ESPOO, Finland
Partners and Funders Details
| Consortium Partner | Country | Funder | |
|---|---|---|---|
| Aalto University https://www.aalto.fi/en/department-of-chemistry-and-materials-science |
University | Finland | FI-AKA |
| Institute of Electrical Engineering, Slovak Academy of Sciences |
Research org. | Slovakia | SK-SAS |
| ATLANT 3D Nanosystems Aps |
SME | Denmark | DK-IFD |
| Ghent University https://www.ugent.be/we/solidstatesciences/cocoon/en |
University | Belgium | No Funding |
| Lund University https://www.fysik.lu.se |
University | Sweden | No Funding |